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What are the listed companies in the chip technology industry?
DSP and CPU are recognized as two core technologies in the chip industry. The highest level of domestic CPU product research and development is represented by "Godson" and DSP is represented by "Hanxin". Experts pointed out that since 2000, China has used nearly 654.38 billion yuan of foreign DSP chips every year. By 2005, the market demand for DSP in China will exceed $3 billion, with an annual growth rate of over 40%.

[1], Variety Shares (600770):

The company shares in Beijing Shenzhou Loongson Integrated Circuit Design Co., Ltd. (established in August 2002 as a joint venture with the Institute of Computing Technology of Chinese Academy of Sciences with a registered capital of 654.38 billion yuan), and is engaged in research and development and sales of "Loongson" series microprocessor chips with independent intellectual property rights. The launch of Loongson 1 and 2 broke the long-term dependence of China on foreign CPU products. Stmicroelectronics, the fifth largest integrated circuit manufacturer in the world, decided to purchase the production and global sales rights of Godson 2E. At present, Godson Research Group is designing Godson 3 multi-core processor, which has outstanding advantages such as energy saving and high security.

[2], Datang Telecom (600 198):

Datang Microelectronics, a 95% subsidiary of the company, is the real leader of EMV cards in China, with independent design capability and complete intellectual property rights of EMV cards. The progress of chip products obtaining EMV certification is at least 0.5 years ahead of domestic competitors/kloc-0. Therefore, once the large-scale migration of domestic EMV cards starts, the company will take the lead in benefiting, which is expected to break out with the market, thus promoting the company's performance to exceed expectations.

[3], Tongfang shares (600 100):

Beijing Tongfang Microelectronics Co., Ltd. (hereinafter referred to as "Tongfang Microelectronics"), a subsidiary of the company holding 86% of the shares, is a professional integrated circuit design company jointly funded by Tsinghua Holdings Co., Ltd. and Tongfang Microelectronics, which is mainly engaged in the design, development and sales of integrated circuit chips and provides system solutions. At present, the main products are smart card chips and supporting systems, including contactless memory card chips, contact and contactless CPU card chips and RF read-write modules. The company has successfully undertaken the research, development and supply of the second-generation national identity card special chip, and is one of the major suppliers. Qingxin Optoelectronics, a subsidiary of the company holding 55% shares, is a high-tech enterprise that produces high-brightness GaN-based LED epitaxial wafers and chips, and the product quality has reached the world advanced level. With the international team mastering the latest core technology of high-brightness LED as the core, the company relies on Tsinghua University's technical strength and various resources to build a world-class photoelectric enterprise. The company has the ability to design and manufacture MOCVD, the key equipment for LED epitaxial growth.

[4], ST Shanghai Branch (600608):

Suzhou Guo Xin Technology Co., Ltd., a 70.3 1% subsidiary of the company, is the crystallization of the cooperation between China Ministry of Information Industry and Motorola in China, and accepts Motorola's advanced level of low power consumption and high performance 32-bit RISC embedded CPU M*Core? Technology and its SoC design method; Establish a 32-bit RISCC * core with independent property rights in Suzhou Guo Xin from a high starting point? . On the basis of M*Core M2 10/M3 10, C*Core? Series 32-bit CPU cores C305/C 310/CS 320/C340/C340m; Established a C * core? C*SoC 100/200/300 is the core design platform; And obtained a number of national patents and software copyrights. Shanghai Jiaotong University Chuangqi Microsystems Technology Co., Ltd., a 75% subsidiary of the company, is mainly engaged in the design, research and development, production, sales, system integration and computer software development of microelectronic integrated circuit chips and systems, electronic products and communication equipment systems. 32-bit DSP was jointly developed by Jiaotong University Research Center and Jiaotong University Chuangqi, 16-bit DSP was developed by the Research Center, and Jiaotong University Chuangqi was responsible for industrialization.

(2) Chip manufacturing

[1], Zhangjiang Hi-Tech (600895):

On August 22nd, 2003, Zhangjiang Hi-Tech announced that it would subscribe for 45 million Series A preferred shares of SMIC through its wholly-owned overseas subsidiary WLT at the price of1.1USD/share, accounting for about 5% of SMIC's shares at that time. On March 5, 2004, Zhangjiang Hi-Tech announced again that WLT, a wholly-owned subsidiary of the company, subscribed for SMIC 342857 1 Series C preferred shares again at the price of $3.50 per share. After the capital increase, the company holds 45,000,450 SMIC A series preferred shares and 342,8571C series preferred shares. SMIC has occupied more than 50% of the mainland chip foundry market, and it is the largest and most advanced integrated circuit manufacturing enterprise in China. By the first half of 2003, SMIC had become the fifth largest chip foundry in the world.

[2], Shanghai Belling (600 17 1):

The company is a leading enterprise in the integrated circuit industry in China, mainly engaged in the design, manufacture and technical services of integrated circuits, and involved in the fields of silicon wafer processing, electronic tags and fingerprint authentication. The company has more independent intellectual property rights, and has applied for and authorized more than 220 intellectual property rights since 2002. Formed an industrial chain of chip OEM, design, application and system design. The company invested heavily in the construction of an 8-inch 0.25 micron integrated circuit production line, and jointly established the Shanghai integrated circuit R&D center with the major shareholder Hua Hong Group, which helped to enhance the company's competitiveness. Shanghai Hua Hong NEC is a world-class integrated circuit manufacturing enterprise, with the current international mainstream 0.25 and 0. 18 micron chip processing technology, which is the core project of the national "909" project and has considerable strength.

[3], Shi Lanwei (600460):

The company is the leader in the domestic integrated circuit design industry, ranking second only to Datang Microelectronics. The technology mastered and owned by the company can be used for the development of high-end products, and the core technology is at a high level in the same industry in China, which has obvious competitive advantages. The company has two most profitable businesses in the field of integrated circuits-chip design and manufacturing, which have the synergistic advantages of design and manufacturing. At present, we specialize in the design, manufacture and sales of CMOS, BiCMOS and bipolar consumer integrated circuits. The company has developed and produced more than 100 kinds of integrated circuits, with an annual output of nearly 200 million integrated circuits. The company has the design capability of 0.5-0.6 micron CMOS chip and 200,000 logic chip.

[4], Fang (000055):

During the Tenth Five-Year Plan period, Fangda undertook and completed the major scientific and technological research project of national semiconductor lighting industrialization, and the successfully developed Tiger series semiconductor lighting chips were listed as national key new products. Fangda owns Shenzhen Semiconductor Lighting Engineering R&D Center. During the 11th Five-Year Plan period, we undertook the national "863" semiconductor lighting project "High-efficiency and high-power GaN LED chip and white light source manufacturing technology for semiconductor lighting", the Guangdong science and technology plan project "Metal organic vapor deposition growth technology for surface roughening of GaN-based blue light epitaxial wafer" and the Shenzhen science and technology plan project "Development of 80 mil blue light LED chip for semiconductor lighting".

[5], China Microelectronics (600360):

This company is a leading power semiconductor device enterprise in China. Through its own brand operation mode, the company has completed the whole industrial chain layout from chip manufacturing, packaging and sales. At present, the company's main device products have a high market share in the domestic market, which will help the company to better resist the influence of the overall fluctuation of the industry than its peers. The pace of replacing incandescent lamps with energy-saving lamps has been further accelerated. As the main supplier of energy-saving lamp power devices in China, the company will benefit from the development of energy-saving lamp industry in China. At the same time, the company's 6-inch MOSFET production line has been put into trial production, and various conditions for realizing import substitution are basically mature.

[6], Sichuan Changhong (600839):

The company has formed a diversified and comprehensive multinational enterprise group integrating digital TV, air conditioner, refrigerator, IT, communication, digital, network, commercial system electronics and other industries. On February 3, 2009, the bidding results of the "Home Appliances to the Countryside" project initiated by the Ministry of Commerce and the Ministry of Finance were announced. Sichuan Changhong won the Grand Slam for the third time, and all 70 bidding products of the company, such as color TV, refrigerator, freezer, mobile phone and washing machine, won the bid, with a winning rate of 100%. The successful development of SOC (Apollo 1) chip with independent intellectual property rights indicates that the company has reached the international advanced level in the field of audio and video processing of VLSI.

[7], hisense electric (600060):

Hisense Core Technology Co., Ltd., a subsidiary of the company holding 79.68% shares, is a high-tech subsidiary of Hisense Group, which mainly focuses on digital TV chips. In June 2005, "Hiview New Core" came out, which can be widely used in various flat-panel TVs, CRT TVs, various rear projection TVs and display devices. The chip has obtained more than 30 patents (including 9 invention patents), and these patented technologies all have independent intellectual property rights.

[8], Shen Konka A(0000 16):

The company is one of the well-known color TV brands in China, and its market share in the field of high-definition LCD and domestic flat-panel TV is far ahead. Shenkangjia officially released a brand-new category TV-NetRui TV, which takes intelligent interaction and all-round upgrade as its core selling point, integrates family entertainment and personal experience, and leads flat-panel TVs to return to the family entertainment center collectively. Netsharp TV is equipped with the "Sharp Core" technology independently developed by Konka, which is the first in the industry and integrates the traditional TV chip MSD209, the network processing chip CC 1203 and the national standard terrestrial digital TV chip LGS-8G52.

(3) Chip package test

[1], Tongfu Microelectronics (002 156):

The company is mainly engaged in the packaging and testing business of integrated circuits. At present, it is a packaging test manufacturer in China that realizes mass production of high-end packaging test technologies MCM and MEMS, and its technical strength is in a leading position. The company is an IC packaging and testing foundry, which accepts orders from chip design or manufacturing enterprises in the form of processing materials, provides packaging and testing services for them, and charges processing fees according to the amount of packaging. Its IC packaging test scale ranks in the forefront among domestic holding enterprises.

[2], Changdian Technology (600584):

The company is the largest semiconductor packaging production base in China, a well-known domestic manufacturer of transistors and integrated circuits, and its product quality is at the leading level in China. It has three core IC technology research and development platforms synchronized with international advanced technologies, forming an annual production capacity of 7.5 billion integrated circuits, 25 billion large, medium and small power transistors and 65.438+0.2 million discrete device chips. It has become the largest semiconductor packaging and testing enterprise in China and is making every effort to squeeze into the top five in the world. Some products of the company are designated as military products by the Commission of Science, Technology and Industry for National Defense, and are widely used in aviation, aerospace, military engineering, electronic information, automatic control and other fields.

[3], Huatian Technology (002 185):

The company is mainly engaged in the packaging and testing business of semiconductor integrated circuits and semiconductor components, and is one of the key integrated circuit packaging and testing enterprises in China. The company's packaging capacity and technical level rank third among domestic enterprises, and it is the largest integrated circuit packaging base in western China and a modern high-tech enterprise with innovative spirit. The company was rated as the most growing packaging and testing enterprise in China. With the strong support of policies and taxes, we independently developed a series of integrated circuit packaging technologies and entered the high-end field of integrated circuit packaging.

[4], Taiji Industry (600667):

The cooperation between Taiji Industry and South Korea Hynix will enable the company to enter the semiconductor integrated circuit industry with more growth and development prospects through the establishment of a joint venture company, and also create an opportunity for the company's future industrial structure transformation. Hynix invested $350 million in a large-scale integrated circuit packaging and testing project, which can form a production supporting capacity of 654.38+200,000 wafers for testing and 75 million wafers for packaging every month. Taiji Industry's participation in this project will change from a single business model to a dual main business model including IC packaging and testing.

[5] Suzhou solid technetium (002079):

The company's main products are all kinds of semiconductor diodes (excluding photodiodes), with comprehensive diode wafer and chip design and manufacturing, diode packaging and testing capabilities, and maintains a leading position in the domestic semiconductor discrete device industry 10 and diode sub-industries. The company increased its investment in QFN packaging products with higher technical content and gross profit margin, which gradually transformed the company from a simple semiconductor discrete device manufacturer to an integrated circuit packaging enterprise. The company is the earliest enterprise engaged in QFN packaging research and industrialization in China. At present, it can produce all kinds of integrated circuit products packaged in QFN/DFN, and it is the largest integrated circuit packaging enterprise in China.

(Pin Gu Ba pingu8.com finishing)

(d) chip dependency

[1], Kangqiang Electronics (002 1 19):

The company is mainly engaged in the production of lead frames and bonding wires for semiconductor packaging. The company ranks first in the lead frame sales industry and second in the bonding wire sales industry. The national coverage rate is as high as 60%, and it is a leading subdivision in the electronic field. The company's integrated circuit framework, power electronic device framework, surface mount component framework and TO-92, TO-3P and other discrete device frameworks ranked first among domestic peers for eleven consecutive years, leading the industry.

[2], Sanjia Technology (600520):

The company is mainly engaged in the design, research and development and production of special molds for semiconductor integrated circuits and chemical building materials. Is the only listed mold manufacturing enterprise in the two cities, with unique industry advantages. The production and sales volume of integrated circuit plastic packaging mold and plastic profile extrusion mold produced by the company ranks first in China, and the domestic market share is 15% and 30% respectively. Now it has an annual output of 1500 sets of extrusion dies for chemical building materials, 100 sets of downstream extrusion equipment, 200 sets of semiconductor plastic packaging presses, 200 sets of semiconductor plastic packaging dies, 60 sets of semiconductor automatic packaging systems (rib cutting and molding) and 4 billion integrated circuit lead frames.

[3] You Yansi shares (600206):

The company is an important base for research, development and production of semiconductor materials with international advanced level in China, with strong technical force. The company has successively developed the first batch of 6-inch, 8-inch and 12-inch silicon single crystals in China, making China one of the few countries in the world with the technology of drawing 12-inch silicon single crystals.