Soon, in 1839, Becker discovered that the junction formed by the contact of semiconductor and electrolyte would generate voltage under illumination, which was later called photovoltaic effect, which was the second characteristic of semiconductor discovered.
In 1874, Braun observed that the conductivity of some sulfides is related to the direction of the applied electric field, that is, their conductivity is directional, and it will conduct when a DC voltage is applied across them; If the voltage polarity is reversed, it will not conduct electricity, which is the rectification effect of semiconductors and the third characteristic of semiconductors. In the same year, Schuster discovered the rectification effect of copper and copper oxide.
1873, Smith of Britain discovered the photoconductive effect of selenium crystal material with increased conductance under illumination, which is another unique property of semiconductor. Although these four effects of semiconductors were discovered before 1880, the term semiconductor was first used by Kauniberg and Weiss at about 19 1 1. Summing up these four characteristics of semiconductors, Bell Laboratories didn't finish it until June1947+February.
Many people will ask, why did it take so many years for semiconductors to be recognized? The main reason is that the materials at that time were impure. Without good materials, many problems related to materials are difficult to explain clearly.
The conductivity of semiconductor at room temperature is about10 ˉ10 ~10000/ω cm, and the conductivity of pure semiconductor increases exponentially with the increase of temperature. There are many kinds of semiconductor materials, which can be divided into elemental semiconductors and compound semiconductors according to their chemical composition. In addition to the above crystalline semiconductors, there are amorphous organic semiconductors and intrinsic semiconductors.
1982 The integrated circuit production line of Jiangsu Wuxi Jiangnan Radio Equipment Factory (742 Factory) was completed, accepted and put into production. This is a chip production line that completely imports color and black-and-white TV integrated circuits from Toshiba, Japan. It has not only packaging, but also 3-inch brand-new process equipment. This paper not only introduces "hardware" such as equipment, purification workshop and power equipment, but also introduces "software" such as manufacturing technology. This is the first time that China has introduced integrated circuit technology from abroad. In the first phase, 742 Factory invested 270 million yuan (US$ 66 million), and the construction goal is to invest 1 10,000 3-inch silicon wafers every month, with an annual output of 26.48 million IC products, which are bipolar consumption linear circuits, including TV circuits and audio circuits. By 1984, the output reached 30 million pieces, making it the largest professional chemical plant with advanced technology and industrialized production in China. 1982 10 In order to strengthen the leading position of computers and large-scale integrated circuits in China, the State Council established the "Leading Group for Electronic Computers and Large-scale Integrated Circuits" headed by Vice Premier Wan Li, formulated the development plan of integrated circuits in China, and proposed that the semiconductor industry should undergo technological transformation during the Sixth Five-Year Plan period. 1983, in view of the situation of multi-head introduction and repeated layout at that time, the leading group of large-scale integrated circuits in the State Council put forward the development strategy of "controlling dispersion and controlling chaos", and integrated circuits should "establish two bases in the north and south". The southern base mainly refers to Shanghai, Jiangsu and Zhejiang, and the northern base mainly refers to Beijing, Tianjin and Shenyang, and a little refers to Xi 'an, mainly for space matching.
1986, Xiamen integrated circuit development strategy seminar of the Ministry of Electronic Industry put forward the development strategy of China's integrated circuit technology "53 1" during the Seventh Five-Year Plan period, that is, popularizing 5 micron technology, developing 3 micron technology and tackling key scientific and technological problems of 1 micron technology. 1988, 87 1 Factory Shaoxing Branch was renamed as Kazuki Watanabe musician Microelectronics Co., Ltd. 1988. On the basis of technology introduction project and new factory building, Shanghai Beiling Microelectronics Manufacturing Co., Ltd. was established as a Sino-foreign joint venture company. 1988, based on the technology import project jointly undertaken by Shanghai Component No.5 Factory, Shanghai No.7 Factory and Shanghai No.19 Factory, a Sino-foreign joint venture company, Shanghai Philips Semiconductor Company (now advanced in Shanghai) was established. 1In February, 1989, the Ministry of Mechanical and Electrical Engineering held a seminar on the development strategy of integrated circuits during the Eighth Five-Year Plan in Wuxi, and put forward the development strategy of "accelerating base construction, forming large-scale production, attaching importance to the development of special circuits, strengthening scientific research and supporting conditions, and revitalizing the integrated circuit industry". On August 8th,1989,742 Factory and Wuxi Branch of Yongchuan Semiconductor Research Institute merged to form China Huajing Electronics Group Company.
1990 10 In Beijing, the State Planning Commission and the Ministry of Mechanical and Electrical Engineering jointly held a forum attended by relevant leaders and experts, and reported it to the CPC Central Committee, and decided to implement the 908 Project. 199 1 year, Shougang NEC electronics co., ltd was established by capital iron and steel company and Japan NEC company. From 65438 to 0995, the Ministry of Electronics put forward the development strategy of integrated circuits in the Ninth Five-Year Plan: market-oriented, taking CAD as the breakthrough, combining mining with mining in Industry-University-Research, carrying out international cooperation, strengthening investment, strengthening the construction of key projects and technological innovation capabilities, and promoting the integrated circuit industry to enter a virtuous circle. 1995 10 In Beijing, the Ministry of Electronic Industry and the State Administration of Foreign Experts Affairs jointly held a symposium of experts at home and abroad to offer suggestions and suggestions for accelerating the development of China's integrated circuit industry. 165438+ 10, the Ministry of Electronics made a special report to the State Council and decided to implement the 909 project. 1July, 1997 17, Shanghai Hua Hong NEC electronics co., ltd, a joint venture between Shanghai Hua Hong group and Japanese NEC company, was established, with a total investment of/kloc-0.2 billion USD and a registered capital of 700 million USD. NEC of Hua Hong mainly undertook the "909" project construction of VLSI chip production line. 1998 65438+ 10, Huajing signed a contract with Shang Hua to produce MOS wafers, and the contract is valid for four years. Huajing Chip Production Line began to undertake the processing business of Shang Hua Company. 199865438+1October 18, Huajing project, the main project of "908", passed the acceptance of foreign contracts. This 0.9 micron production line imported from Lucent Technology Company has a monthly production capacity of 6,000 6-inch wafers. 1998 65438+ 10, China Huada integrated circuit design center introduced Panda 2000 system to domestic and foreign users, which is an EDA system independently developed by China, and can meet the requirements of submicron and deep submicron processes, with a processing scale of one million gates and support high-level design. 1February 1998, Shaoguang and Li Qun signed an LSI joint venture project in Changsha with an investment of 240 million yuan. The joint venture will build large-scale integrated circuit (LSI) micro-packaging, forming a production capacity of 52 million integrated circuit packaging and testing. 1February 28th, 998, the first 8-inch silicon single crystal polishing wafer production line in China was completed and put into operation. This project is carried out in the National Engineering Research Center of Semiconductor Materials of Beijing Institute of Nonferrous Metals. 1998 March 16, Beijing Hua Hong IC Design Co., Ltd. and Japanese NEC Co., Ltd. held the signing ceremony of the joint venture contract of Beijing Hua Hong NEC IC Design Company in Beijing Great Wall Hotel. The newly established joint venture company has a design capacity of about 200 IC varieties per year, and provides processing orders for 20,000 8-inch silicon wafers for NEC production line in Hua Hong every year. 1April, 1998, nine product design and development centers of integrated circuit "908" project passed the acceptance and were awarded the license. The nine design centers are the 15th Institute of Electronics of the Ministry of Information Industry, the 5th Institute of Electronics of the Ministry of Information Industry, Shanghai Integrated Circuit Design Company, Shenzhen Xianke Design Center, Hangzhou Oriental Design Center, Guangdong Special Circuit Design Center, Weapon 2 14 Research Institute, and Beijing Institute of Mechanical Industry Automation and Aerospace Industry 7765438+. These design centers were built together with Huajing six-inch production line project. 1June, 1998, the second phase of Hua Hong NEC 909 project started. 1June, 1998 12, the first phase of Shenzhen-Hong Kong VLSI project-post-process production line and design center was officially put into operation in Shenzhen Saiyifa Microelectronics Co., Ltd., and the annual production capacity of integrated circuit packaging and testing increased from the original design of 30/kloc-0.8 million chips to the current 730 million chips, and will be expanded to the level of/kloc-0.0 billion chips. 1998 10, the production line of Japanese Fujitsu equipment and technology imported from Kazuki Watanabe musician IC began to accept trial production. It is a pre-process production line and power supply supporting system mainly based on bipolar technology. Bi-CMOS technology has a 2 micron process level, with an annual investment of 5-inch silicon wafers/kloc-0.50 million pieces and an annual output of various integrated circuit chips/kloc-0.00 billion pieces. 1In March, 1998, the first CMOS miniature color camera chip designed and developed by Xi Jiaotong University Kaiyuan Group Microelectronics Technology Co., Ltd. was successfully developed, which is a gratifying achievement in the design and development of visual chips in China. 1On February 23rd, 1999, Shanghai Hua Hong NEC Electronics Co., Ltd. completed the trial production, and the process level was raised from 0.5 micron planned to 0.35 micron. The leading product was 64M synchronous dynamic memory (S-DRAM). The completion of this production line indicates that China has its own deep submicron VLSI chip production line since then.