The circuit board we usually see is welded with components on the basis of PCB, that is, PCB assembly, and PCB is a "bare board" or a "light board", that is, PCB is the circuit board before welding components, and PCB and circuit components are assembled together through the process of processing and assembly to form a circuit board actually used for electronic products.
1936, the Austrian Paul isler, the creator of printed circuit boards, first adopted printed circuit boards in radio equipment.
1943, Americans mostly use this technology in military radio stations. 1947, NASA and the American Bureau of Standards launched the first PCB technology seminar. 1948, the United States officially recognized this invention and used it for commercial purposes. In the early 1950s, due to the problems of bonding strength and welding resistance between copper clad laminate and copper foil, the performance was stable and reliable, and industrial production was realized. Copper foil etching has become the mainstream of PCB manufacturing technology, and single boards have been produced. In 1960s, the hole metallized double-sided PCB was realized and mass production was realized. In 1970s, multi-layer PCB developed rapidly, and it continued to develop in the direction of high precision, high density, fine lines and small holes, high reliability, low cost and automatic continuous production. In 1980s, surface mount printed board (SMT) gradually replaced plug-in PCB and became the mainstream of production. Since 1990s, surface mount has further developed from flat package (QFP) to ball mount array package (BGA). Since the beginning of 2 1 century, high-density BGA, chip-level packaging and multi-chip module packaging printed boards based on organic laminates have developed rapidly.
From 65438 to 0956, China began to develop PCB.
In the 1960s, single boards were produced in batches, double boards were produced in small batches, and multilayer boards were developed. In 1970s, due to the limitation of historical conditions at that time, the development of PCB technology was slow, which made the whole production technology lag behind the advanced level abroad. In 1980s, advanced single-sided, double-sided and multi-layer PCB production lines were introduced from abroad, which improved the production technology level of PCB in China. In 1990s, foreign PCB manufacturers from Hongkong, Taiwan Province and Japan came to China to establish joint ventures and wholly-owned factories, which made the PCB production and technology in China advance by leaps and bounds. In 2002, it became the third largest PCB manufacturer. In 2003, the output value and import and export value of PCB exceeded 6 billion US dollars, surpassing the United States for the first time and becoming the second largest PCB producer in the world. The proportion of output value also rose from 8.54% in 2000 to 15.30%, an increase of nearly 1 times. In 2006, China has replaced Japan as the world's largest PCB production base and the most active country in technology development. In recent years, the PCB industry in China has maintained a high growth rate of about 20%, which is much higher than that of the global PCB industry.